EC BOND

EC BOND is a product designed to provide micro-crack tolerance and eliminate all potential negative effects due to calibration loss leading to decreased laser power and resulting micro-cracks in laser-sintered crowns and bridges.

EC BOND is a material in powder form (0.01 to 0.02mm micro-fineness) used for porcelain bonding of conventional dental metal alloy constructions sintered in laser sintering technique. It contains oxide-absorbing materials that absorb the oxide layer formed on the metal, allowing the glassy binder to form a stronger bond with the oxide-free metal.

Application Area:

It is used in chromium-cobalt structures in metal-ceramic crown bridge works. EC Bond forms in different tones between gold and orange depending on the oxide density of the metal.

Usage Instructions:

Metal Preparation:

1. Sandblast with aluminum oxide sand.
2. Clean by boiling in distilled water for 10 minutes or using steam in an ultrasonic bath.
3. Completely dry the metal construction and only contact it with a clean presser.
4. Mix EC Bond with Standard or Extra Creamy Opaker Liquid until creamy.
5. Apply thinly and homogeneously onto the metal surface.
6. Sinter according to the recommended program.

Preheating Temperature: 500°C

Pre-drying Time: 4 – 5 minutes

Minute / Heat: 100°C

Vacuum Start: 500°C

Vacuum End: 980°C

Maximum Heat: 980°C

Waiting at Maximum Heat: 1 minute

Continue with the opaquing firing cycle recommended by the porcelain manufacturer.

Possible Problems and Solutions:

1. Metal detachment and separations:
   1. Application on non-sandblasted metal after degassing.
   2. Direct bonding application without oxidation.
   3. Application of bonding onto excessive oxide formation on the metal surface after oxidation.
   4. Sanding with fine sand during sandblasting, leading to insufficient physical bonding surface.
   5. Sintering without following the provided program; adherence to the heating rate and maximum heat values is crucial.
   6. Repeated casting of the same metals leading to alteration of thermal expansion coefficients and consequent stresses causing cracks or detachments.
2. Excessive thickness of applied bonding: Resulting in crack formation and detachment, especially in thick areas and over the framework.
3. Insufficient pre-drying time: Leads to swelling of the bonding layer, causing it to peel off from the metal surface or form bubbles.

Safety Instructions:

Skin Contact:

EC Bond normally does not irritate the skin. Wash immediately with plenty of soap and water.

Eye Contact:

Rinse continuously with running water.

Ingestion:

Seek medical assistance if necessary.

Storage Conditions and Shelf Life:

EC Bond should be stored tightly closed in a dry place. Under suitable storage conditions, the expiration date is unlimited. The package can be disposed of with household waste.